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EUROPE'S PREMIER AM EVENT IS BACK

The Additive Manufacturing for Aerospace & Space conference is returning for its first Virtual Exchange – to host strategic leaders and decision makers from across  the world in an exclusive and secure virtual meeting place. In recent years it has firmly established itself as the premier forum for AM users, R&D experts, and industry partners within the aerospace and space industry. However by hosting the first Virtual Exchange, it will connect the leaders from the User community with each other, and the latest solutions can that help them acquire, implement and upscale their AM capabilities with maximum effectiveness.

AM for Aerospace and Space is the leading conference platform for ensuring opportunities in high value manufacturing are not squandered and so that the aerospace industry is prepared to tackle the roadblocks of industrialisation of AM technology. This Exchange will host a day full of content to tack the hard questions, surrounding the future roadmap for industrial AM as well as the ways in which we can collaborate to share in the successes of this technology.

We will host keynote presentations, panel discussions and discussion groups to provide a platform to support opportunities in high value manufacturing and help prepare the aerospace industry to tackle the roadblocks of industrial digitisation. It also represents a unique opportunity to maintain and build connections during a challenging time.

2021 Speakers Include:

Key themes include:

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A cost-effective, collaborative and innovative future vision for AM.

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Discussing industry-wide challenges to upscaling AM production and implementing new capabilities.

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Integration challenges in the Aerospace and Space sectors and how to overcome them.

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The AM supply chain of the future: including workflow integration, digital inventory and maintaining consistency.

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Building a culture of AM; both within your own organisation and across the industry as a whole.

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Proposing the way forward for AM including disruptive technologies, and potential future limitations on size and complexity.

Testimonials